Signal Integrity: Back to Basics

EPEPS: Electrical Performance of Electronic Packaging and Systems Conference

October 13, 2009 · Leave a Comment

(Syndicated content from: http://signal-integrity.tm.agilent.com/2009/epeps-electrical-performance-of-electronic-packaging-and-systems-conference/)

At the Agilent EEsof EDA exhibit at the Electrical Performance of Electronic Packaging and Systems Conference 2009 (EPEPS 2009) we’ll demonstrate the "what if" design space exploration workflow using our new statistical eye diagram channel simulator.

You’ll see a demo of signal integrity features that are new in ADS 2009 Update 1, including equalizers, and our DDR3 Compliance DesignKit.

Exhibit Dates: October 19-20, 2009
Exhibit Times: 9AM-6PM
Location: Embassy Suites – Portland/Tigard
9000 SW Washington Square Road
Tigard Oregon 97223

Hope you can make it!

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ADS 2009 Signal Integrity Eye Diagram Solutions

September 15, 2009 · Leave a Comment

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We’ve Moved! Please Updated Your Bookmarks!

September 5, 2009 · Leave a Comment

The overhead of syndicating the content here seems to outweigh the benefits, so this is the last post here. Please bookmark our new Signal Integrity site instead. Thanks!

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GPU-Accelerated Time-Domain Circuit Simulation Paper at CICC

September 2, 2009 · Leave a Comment

(Syndicated content from: http://signal-integrity-tips.com/2009/gpu-accelerated-time-domain-circuit-simulation-paper-at-cicc/)

IEEE CICC logo

Tired of waiting for your SPICE simulations to complete?

My colleague Rick Poore will be presenting IEEE Custom Integrated Circuits Conference (CICC) paper 20-3 about his work on “GPU-Accelerated Time-Domain Circuit Simulation” in San Jose at 11:05AM on Wednesday, September 16th.

Abstract

Time-domain circuit simulation is dominated by transistor model evaluation. A modern graphics processing unit (GPU) is a parallel, high performance computer suitable for non-graphics tasks. Simulation is sped up by 3-6x by moving transistor evaluation to a GPU. Implications for writing transistor models for good GPU performance are discussed.

Related posts

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Geometric Form Factor for Transmission Lines

September 1, 2009 · Leave a Comment

(Syndicated content from: http://signal-integrity-tips.com/2009/geometric-form-factor-for-transmission-lines/)

The concept of a geometric form factor is very useful when thinking about transmission lines. It bundles up all the messy 2D geometry of cross-sections and field line patterns into one scalar quantity that is fixed for a particular configuration. Then you can think about the general concepts without getting bogged down in field integrals and field solvers.

To explore this idea, let’s start with a uniform relative dielectric constant εr like you’d have with stripline. (Later we’ll generalize to the case where the field lines “sees” a mixture of materials, for example dielectric and air for a microstrip.)

First define a unitless geometric form factor, F, such that capacitance per unit length, C, is:
C is epsilon 0 epsilon r / F
…where ε0 is the vacuum permittivity, 8.9pF/m (or 0.22pF/inch) and εr is the relative permittivity (relative dielectric constant), ~4.2 to 4.6 in FR4 glass/resin.

In general, we need a 2D electrostatic solver to determine F but let’s first look at a geometry for which there’s an exact, textbook, analytical solution: a rod of radius a, with its center a distance b above a ground plane like this:
rod above plane
The form factor is:
Form factor for rod above plane
Couple of thing to note about F:
Unitless: F is a function of a geometric ratio, b/a.
Logarithm of a smallish ratio: In practical cases, the numerator and divisor are not of wildly different orders of magnitude. You wouldn’t create a transmission line with a = 1 mm and b = 1 km! No, for the realistic range of values of b/a, the natural logarithm of the function here is of order 1. For example if b=2a, then F is 0.21.

Let’s plot it and two other configurations (illustrated below) and you’ll see that (apart from the “short circuit” corner case at a = b) the blue curve varies slowly with b/a:

Plot of form factor for rod above plane, coax, and stripline
The neat thing about the form factor is that when you have it for capacitance, you get inductance and impedance “for free.” To see the first of these, consider the propagation velocity, v, which is both:
Form factor for rod above plane
With a little algebra you can see that the inductance per unit length, L is given by:
L = Fμ0
…where μ0 is the vacuum permeability, 1.3 μH/m
Thus, you can think of F as “how inductive the geometry is versus the free space value of 1.”
If F < 1 the geometry is “more capacitive” than free space, if F > 1 it’s “more inductive.”
The second benefits is that once you have L and C, you also have impedance. Again a little algebra shows that:
Form factor for rod above plane
…where Z0 is the vacuum impedance, 377 Ω. The form factor and the relative dielectric constant determine how far the line impedance is from the “natural” value of Ω. A “capacitive” form factor < 1 lowers the impedance, as does a higher relative dielectric constant. If εr = 4.2, and you want Z = 50 Ω, then pick your geometry such that F is 0.27.

If you take the ground plane and wrap it around the rod, you get co-ax:
coaxial cylinders
The form factor (magenta line above) is a bit lower (more capacitive) as you’d expect from bring the ground plane closer.

If instead you squash the rod into a ribbon and put a second ground plane on top, you get stripline:
stripline
The result is a bit less capactive, because the squashing increases the separation from ground.

You can generalize this idea to non-uniform dielectrics by using a blended or “effective” relative dielectric constant. In a future posting, I’ll also show how it’s useful for lumped elements like inductors from flat coils, and short and long solenoids.

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Hands-on Workshops for Statistical Mode of Channel Simulator … and More!

August 26, 2009 · Leave a Comment

(Syndicated content from: http://signal-integrity-tips.com/2009/ands-on-workshops-statistical-mode-channel-simulator/)

We’re offering five complementary signal integrity hands-on workshops entitled “Design Using Fast Channel Simulation and Statistical Eye Diagrams.” Seating is limited for this complimentary event. Early enrollment is advised.

Why this workshop is important

Signal integrity engineers need to determine ultralow BER contours for thousands of points in the design space in order to select the optimum set of characteristics for transmitter, channel, and receiver. Traditional techniques consume a prohibitively long simulation time. For this reason we’ve implemented a new statistical mode in our Channel Simulator that eliminates the need for long, multi-million-bit simulations. Now you can generate eye diagrams with ultralow BER contours in just a few seconds.

This in-depth hands-on workshop will demonstrate the “what if” design space exploration workflow that our new statistical eye diagram channel simulator enables, and will also cover tools and modes that can be used in exceptional cases (e.g. equalizer adaptation, non-linearity, or specific bit patterns) where statistical eye techniques cannot be applied.

You will get first hand experiencing using signal integrity features that are new in ADS 2009 Update 1 and EMPro 2009, including equalizers, DDR compliance toolkit, and via simulation with 3DEM.

Who should attend this workshop

Signal integrity engineers for multigigabit links who are running into effects previously only seen in RF and microwave circuits.

Dates & Locations

September 15, 2009 – Ottawa, ON
September 22, 2009 – Chelmsford, MA
September 24, 2009 – Minneapolis, MN
September 29, 2009 – Santa Clara, CA
October 1, 2009 – Anaheim, CA

Agenda

All times are local
9:30a.m. – Register/Breakfast
10:00a.m. – Hands-on workshop part 1

  • ADS for signal integrity analysis
  • HSPICE netlist including W-element in ADS
  • Modeling and simulation of a PCI Express Gen2 channel using Channel Simulator in:
    • Bit by bit mode
    • Statistical mode
  • Equalizer, LMS, RLS, and ZF, and equalizer tap coefficient calculation

12:00p.m. – Lunch
1:00p.m. – Workshop part 2

  • Channel optimization for eye diagram and BER
  • HDMI transmitter and how it can be modeled in ADS
  • DDR Compliance Toolkit
  • 3DEM simulation of a via model with EMPro

3:00p.m. – End

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S-parameters

August 18, 2009 · Leave a Comment

(Syndicated content from: http://signal-integrity-tips.com/2009/s-parameters/)

Although scattering parameters (S-parameters) have been used by RF and microwave engineers for over 40 years, their adoption still isn’t universal in the signal integrity field. With this informal poll I’m hoping to understand what the barriers (if any) are.

[poll id="33"]
[poll id="34"]

In case I’ve peaked your interest, here are an application note and a seminar presentation on network analysis with S-parameters. They aren’t specific to signal integrity, but are nevertheless very useful in signal integrity engineering:

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Web 2.0 Democratization of First Journalism, Now Conferences?

August 16, 2009 · Leave a Comment

(Syndicated content from: http://signal-integrity-tips.com/2009/web-2-0-democratization-first-journalism-now-conferences/)

The web has democratized journalism by lowering the entry barrier to publishing. Now it seems it’s democratizing conferences: just ask a company to donate its cafeteria or auditorium space for an evening, post some notices on the internet, ask people to bring themselves, their ideas, some sandwiches and soda, and — voilà — instant conference! Start of a trend? Compare the two weeks’ lead time and near zero cost of the announcement below and the 9-month lead time and million dollar budget for, say, DesignCon. Anyway, good luck and power to the people!

Here is Vikash Rungta’s announcement in full.

Folks,

1st event FPGACamp is coming up on Aug’26 at Silicon Valley, CA. The topic of the event is “High Speed Serial Interfaces – Protocols, IPs & Devices”. The event is going to be vendor neutral & technical.

I am here looking for speakers / recommendation for speakers. We would like to have a segment about : what FPGA designers & board designers should know to minimize the SI risk including termination, layout guidelines, power supply & lab bringup (may be list few challenges in bring-up, and tools to debug).

We certainly would like to stay vendor neutral, so we need someone who is not part of one of the vendors.

The admission & booths are completely FREE, so rest of the folks interested in attending/ setting up a booth RSVP at FPGACamp or LinkedIn Events: FPGA Camp High Speed Serial Interfaces

Event Details

The idea behind FPGA Camp is to bring engineers together and discuss FPGA, mainly NextGen FPGA technology, application, methodology, best practices and challenges. Also provide a location to meet other local FPGA designers to share their stories.

We are hoping that this would act as a platform to bring all the FPGA users together more often.

Agenda

5:30 – 6:00: Registration and demo
6:00 – 7:00 : Tech Talk- “High Speed Serial Interface: Protocols, IPs & Devices”
7:00 – 7:30 : Vendor talk- a brief talks from the vendors offering High Speed Serial Interface devices or IPs. (5 to 10 Mns each).
7:30 – 8:00 : Networking and exhibits

High Speed Serial Interface: Protocols, IPs & Devices

Recent expansion in the video usage and growth in the Internet use have created a demand to move more data faster than ever. To meet this demand, system & chip designers are moving towards high speed serial interfaces such as PCIe, XAUI, Interlaken, XFI, 10GbE etc. With FPGA devices currently supporting speeds upto ~12.5Gb per IO pair, which makes FPGAs a unique choice for the next design.

This talk will focus on familiarizing people with various protocols (both currently used & emerging), IPs & Devices which can be used to solve the next system problem.

The talk will be followed by quick presentations from some of the vendors offering these solutions (no marketing talk, only technical).

Thanks,
Vikash

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ADS 2009 Update 1 – What’s New

August 11, 2009 · Leave a Comment

(Syndicated content from: http://signal-integrity-tips.com/2009/ads-2009-update-1-whats-new/)
Here’s a 10-minute video clip about the new statistical mode for Channel Simulator. It does the work of more than 40-hours of transient (SPICE-like) simulation in 40 seconds!.

Click to play What's New in ADS 2009 Update 1 video

PDF of slides with speaker notes

Right click to download MP4 for your iPod or media player

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Which of these conferences are you likely to attend?

August 3, 2009 · Leave a Comment

(Syndicated content from: http://signal-integrity-tips.com/2009/which-of-these-conferences-are-you-likely-to-attend/)

My hope for this straw poll is that we can form a collective opinion about upcoming conferences. Vote for your favorites then see the tally so far in real time. It isn’t scientific, but I think it will give a good feel for the answer. Comments on this (and any other postings) are welcome. To leave a comment, click on the Comments link at the bottom of the posting.

Plan to attend another conference? Please leave a comment below.

[poll id="32"]

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